The high-pressure steaming aging test machine is used for moisture resistance evaluation and robustness testing. The purpose is to evaluate the moisture resistance of non airtight packaged solid-state components in compressed and saturated moisture environments. Accelerate the penetration of moisture (such as plastic packaging materials and chip passivation layers) or design changes (such as chip and electric shock size) at the interface between the metal conductive layer under high voltage and high humidity conditions, in order to identify internal failures in the package.
