艾利讯
广州市艾利讯电子科技有限公司

Liquid cooled plate flow resistance test

Product Mode: Fixed mode of products: Test Speed: Number of tests: Equipment size: Description: Core standard: GB/T 8446.2-2022 "Heat sinks for power semiconductor devices - Part 2: Methods for measuring thermal resistance and flow resistance", which specifies the national standard for joint testing of thermal resistance and flow resistance for domestic power semiconductor heat sinks (air-cooled/self cooled/water-cooled, extruded/cast/heat pipe heat sinks)

Main technical parameters

Key to Thermal Resistance Testing

1. Steady state determination: The temperature change rate is less than the standard specified threshold (GB/T8446.2: Continuous 5-minute temperature fluctuation limit)

2. Insulation shielding: reduce lateral heat dissipation and leakage, otherwise the thermal resistance will be too small

3. Interface: The TIM between the heat source and the heat sink should have a fixed interface pressure and thickness

4. It is necessary to indicate the working conditions: cooling medium type, flow rate/wind speed, medium temperature, ambient temperature, heating power

Key to flow resistance testing

1. Deduct the pressure difference of the testing pipeline, elbow, and valve, and only retain the pressure drop of the sample body

2. The fluid is fully developed, and stable sections (rectification sections) are set up at the inlet and outlet

3. Water cooling: eliminate bubbles; Air cooling: Control the turbulence of the airflow and avoid inlet vortices

4. Output: Complete P-Q curve, not just measuring rated flow single point pressure difference

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广州市艾利讯电子科技有限公司
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